Power chips are linked to exterior circuits with packaging, and their performance relies on the assistance of the packaging. In high-power situations, power chips are typically packaged as power modules. Chip interconnection refers to the electric link on the top surface of the chip, which is typically aluminum bonding cable in standard components. ^
Traditional power module package cross-section
Today, commercial silicon carbide power modules still primarily make use of the product packaging innovation of this wire-bonded traditional silicon IGBT module. They encounter troubles such as big high-frequency parasitic criteria, not enough heat dissipation ability, low-temperature resistance, and not enough insulation strength, which limit the use of silicon carbide semiconductors. The display of excellent efficiency. In order to fix these issues and completely make use of the huge prospective advantages of silicon carbide chips, many new packaging technologies and services for silicon carbide power modules have emerged in recent years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually created from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold cables to copper cables, and the driving force is cost reduction; high-power gadgets have established from light weight aluminum cords (strips) to Cu Clips, and the driving force is to improve product performance. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a solid copper bridge soldered to solder to link chips and pins. Compared to traditional bonding packaging techniques, Cu Clip innovation has the complying with advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a certain extent, replaces the standard wire bonding approach between the chip and the pins. As a result, a special bundle resistance value, higher current flow, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the cost of silver plating and poor silver plating.
3. The product appearance is totally constant with typical products and is mostly used in web servers, portable computers, batteries/drives, graphics cards, motors, power materials, and other fields.
Cu Clip has 2 bonding approaches.
All copper sheet bonding approach
Both the Gate pad and the Source pad are clip-based. This bonding method is a lot more costly and complicated, however it can achieve much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus wire bonding approach
The resource pad uses a Clip approach, and eviction uses a Cable technique. This bonding approach is somewhat cheaper than the all-copper bonding method, conserving wafer location (suitable to really small gateway locations). The procedure is less complex than the all-copper bonding approach and can obtain far better Rdson and much better thermal effect.
Provider of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper oxygen, please feel free to contact us and send an inquiry.
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